We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Flattening Equipment.
ipros is IPROS GMS ・ IPROS One of the largest technical database sites in Japan that collects information on.

Flattening Equipment - List of Manufacturers, Suppliers, Companies and Products

Flattening Equipment Product List

1～2 item / All 2 items

Displayed results
Grinding device Ultra-flatness device FCMP-II series

Grinding device Ultra-flatness device FCMP-II series

Maximizing the features of the wrapping tape makes the intended polishing easy.

As the performance and miniaturization of multilayer build-up substrates progress, increasingly stringent flattening processing is required. The FCMP-II series maximizes the characteristics of the wrapping tape, making it easy to achieve the desired polishing and simplifying equipment management. It enables polishing with minimal hole formation. By selecting the appropriate tape gauge, roughness management becomes easy, and it can be used for both wet and dry applications. Once set up, anyone can use it easily. For more details, please contact us or refer to the catalog.

  • Wafer processing/polishing equipment

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
[Market Report] World Market for Chemical Mechanical Planarization

[Market Report] World Market for Chemical Mechanical Planarization

The global market for chemical mechanical planarization is expected to grow exponentially, reaching 8.59 billion USD by 2031.

The global chemical mechanical planarization (CMP) market is expected to experience significant expansion, supported by the surging demand for advanced semiconductor manufacturing processes. In 2022, the market achieved substantial revenue of 5.4 billion USD, and this upward trend is predicted to continue. By 2031, the global CMP market is projected to reach an astonishing valuation of 8.59 billion USD, demonstrating a robust compound annual growth rate (CAGR) of 5.3% during the forecast period from 2023 to 2031. Chemical mechanical planarization (CMP) has emerged as an essential technology in the semiconductor industry, revolutionizing the manufacturing of microchips. CMP plays a crucial role in the production of high-performance integrated circuits (ICs) by providing a precise and efficient method for polishing and flattening the surface of wafers, enabling the manufacture of smaller, faster, and more energy-efficient semiconductor devices. For application methods, please check the [PDF download] button or apply directly through the related links.

  • others

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
COPYRIGHT © 2001-2025 IPROS CORPORATION ALL RIGHTS RESERVED.